Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
NEO Semiconductor has just unveiled the development of its new 3D X-AI chip technology, which aims to replace DRAM chips inside of HBM to solve data bus bottlenecks, by enabling AI processing through ...
The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...
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This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...
PITTSBURGH, Oct. 2, 2024 /PRNewswire/ -- Faraday Technology Corporation, a leading company in the semiconductor industry, is expanding its use of Ansys (NASDAQ: ANSS) technology to enhance its ...
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Synopsys, Inc. (SNPS): Driving AI Innovation with Advanced Chip Design and 3D-IC Technologies
We recently compiled a list of the 20 Best Artificial Intelligence (AI) Stocks to Buy According to Analysts. In this article, we are going to take a look at where Synopsys, Inc. (NASDAQ:SNPS) stands ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...
Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...
The concepts of 3D-IC and chiplets have the whole industry excited. It potentially marks the next stage in the evolution of the IP industry, but so far, technical difficulties and cost have curtailed ...
The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...
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