The MarketWatch News Department was not involved in the creation of this content. Wafer Defect Inspection System Market to Reach USD 14.43 Billion by 2031 on Rising Advanced Chip Manufacturing | ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

IBM is announcing the first successful test chips at 7nm today, with multiple new innovations. The new processors will use EUV for manufacturing and SiGe-based transistors. Share on Facebook (opens in ...

IBM announced on Wednesday, July 8, 2015, that they built a prototype test processor that will significantly increase computer circuitry power. IBM announced on Wednesday, July 8, 2015, that they ...

Automotive is demanding more emphasis on chip reliability. By 2020, electronic devices will account for over 35% of the manufacturing cost of an automobile, and by 2030, that number is expected to ...

What is the Market Size of Wafer Defect Inspection System? BANGALORE, India, Dec. 16, 2025 /PRNewswire/ -- In 2024, the global market size of Wafer Defect Inspection System was estimated to be worth ...