As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...

Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Chiplets have generated a lot of interest in recent years as design engineers look for alternatives to traditional system-on-chip technology to house complex, multi-function electronics. At the ...

The world we are living in is increasingly becoming software-defined, where artificial intelligence (AI) is adding the next layer of functionality. And it’s driving the need for more compute to enable ...

Monolithic integration has been the dominant approach to chip design since the rise of VLSI-based ASICs decades ago. In a monolithic design, all of the building blocks of integrated circuits such as ...

Chiplet technology is revolutionizing the semiconductor industry by offering alternative advantages compared with traditional monolithic designs. The brand new IDTechEx report on the topic, "Chiplet ...

Forbes contributors publish independent expert analyses and insights. Marco Chiappetta is a technologist who covers semiconductors and AI. Cadence Design Systems made a major advancement with it ...

TAIPEI, Oct. 13, 2025 /PRNewswire/ -- InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will ...