Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...
QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
Dublin, July 07, 2020 (GLOBE NEWSWIRE) -- The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment ...
Infineon Technologies AG introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Infineon Technologies AG introduced automotive qualified 100 percent lead-free power ...
Shibuya-ku, Tokyo, Japan, Japan, Jul 14, 2022, 07:23 /Comserve / -- Die Attach Equipment Market size, share, growth, trends, segmentation, top key players, strategies ...
Motorola Inc.’s semiconductor products sector (SPS) today said it has developed and qualified the first wafer level burn-in and test (WLBT) process for flip-chip microprocessors. Motorola aims to ...
LAB ID offers customized ultrahigh-frequency (UHF) RFID and Near Field Communication (NFC) tags, as well as dual-frequency RFID tags that combine both technologies. The company also provides services ...
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