PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) said today (April 28, 2003) it has developed a style of package it calls flip-chiip on standard leaded (FCOSL) packages. These ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
MILPITAS, Calif. — LSI Logic Corp. here today unveiled its third-generation of organic flip-chip packages, called flxI/O, which uses an area array approach for signal I/O placement to optimize die ...
IBM finds partners for flip chip packagesNews from E-InSiteIBM is working with Amkor Technology, Advanced Semiconductor Engineering, ASAT Holdings and ASAT to develop advanced flip chip substrates and ...
High-reliability packages, always in demand within the automotive, medical, and RF fields, are now going green. A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...
CHANDLER, Ariz., Oct. 17, 2024 (GLOBE NEWSWIRE) -- Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4™ ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback