Are you feeling nostalgic for homogeneous integration of chips – one flat board where you can use your fingers to stuff in all the circuitry you need? Best to head to the Lego store or Russia. The ...

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...

As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation ® will feature ...

In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...