Malaysia today launched its second integrated circuit (IC) design park in Cyberjaya, marking another milestone in its bid to ...
Last year, we saw the announcement of a chip design hub in Puchong, Selangor last year. It was the first of its kind, and now ...
CYBERJAYA, Nov 6 (Bernama) -- The launch of the Integrated Circuit (IC) Design Park 2 in Cyberjaya marks a major step forward in Malaysia’s bid to strengthen its position in the global semiconductor ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
Through education and workforce training, industry partnerships and research innovations, Oregon State University helps keep ...
The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...
Traditional verification methods are proving inadequate for addressing critical reliability challenges in today’s increasingly complex integrated circuit (IC) designs. Modern IC design requires a ...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...
At its most recent earnings call, MediaTek raised its forecast for the total ASIC market from US$40 billion to US$50 billion, reflecting surging demand for cloud AI ASICS. However, an increasing ...
China's push for semiconductor self-sufficiency has extended to networking infrastructure, with Taiwanese IC design firms ...
Chief minister Chow Kon Yeow says this reflects the state’s commitment to building homegrown chip design capabilities.
Microchip Technology’s MCP3909 energy-measurement IC and the MCP3909 3-Phase Energy Meter Reference Design enable designers to quickly design and develop energy meter designs. The IC combines low ...