The IC design industry has seen demand in 2024 vary starkly across different applications: cloud AI-related demand continued to grow month by month, while the edge device sector was fraught with ...

Taiwan's IC design firms remain optimistic about the long-term trajectory of artificial intelligence (AI), but their outlook for the second half of 2025 has turned markedly cautious. Despite strong ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...