3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

The power-performance-area (PPA) metric and time-to-market of modern system-on-chips (SoCs) are dominated by two major issues: on-chip interconnects and layout parasitics. Especially, as the industry ...

Malaysia today launched its second integrated circuit (IC) design park in Cyberjaya, marking another milestone in its bid to ...

Microchip Technology’s MCP3909 energy-measurement IC and the MCP3909 3-Phase Energy Meter Reference Design enable designers to quickly design and develop energy meter designs. The IC combines low ...

CYBERJAYA, Nov 6 (Bernama) -- The launch of the Integrated Circuit (IC) Design Park 2 in Cyberjaya marks a major step forward in Malaysia’s bid to strengthen its position in the global semiconductor ...

Chief minister Chow Kon Yeow says this reflects the state’s commitment to building homegrown chip design capabilities.

The rise of global AI applications has driven increased demand for power ICs, with power management IC (PMIC) design company ...