Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

SMT Corp, a leading provider of electronic component sourcing, testing and analysis services, announced today that it has ...

Figure 1. Ultrasonic testing using pulse echo and through-transmission methods. Pulse echo (left and center) uses a transducer that sends and receives ultrasound energy, producing both A- and B-scan ...

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

What methods can be applied to verify PCB functionality and safety? Which are suitable for mass production and for prototypes? What parameters are checked in each test? How to check a PCB without ...

MINNEAPOLIS--(BUSINESS WIRE)--Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024 Global Technology Award in the ...

A material’s hardness relates to its mechanical resistance when subjected to mechanical indentation by another harder body. Diamond is considered the hardest natural material and is typically used for ...