ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

The AVIA 355-23-250 UV laser is said to offer the highest pulse repetition rate of any Q-switched UV laser, allowing it to perform high-speed wafer-die singulation with high yields. The 355-nm laser ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...

Experience PI’s new piezo wafer stages, granite-based multi-axis systems for thin film metrology, air bearing stages, laser beam steering systems, and sub-nanometer precision piezo stages, backed by ...

As semiconductor technology pushes the limits, "how to cut" has emerged as a key topic in semiconductor packaging, as important as "how to make." Even a circuit diagram drawn precisely with a ...

Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...