Charles Seim is a bridge engineer who worked on dozens of bridges over the course of his career. But one of his early works was a contemplation of forces in a rather different structure: the strapless ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
Download PDF More Formats on IMF eLibrary Order a Print Copy Create Citation This technical note focuses on systemic risk analysis and stress testing as part of the Slovak Republic’s Financial Sector ...
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