High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and ...
Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
Microelectronic device manufacturers can use the IRIS wafer-inspectionsystem from SemiProbe to detect flaws in the wafer circuit pattern, aswell as contamination or process damage. Depending on the ...
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