Abstract: A new packaging structure is presented in this paper. It makes up of a silicon chip with four thermistors and a ceramic substrate for cover, the silicon chip is Au-Au bonded to the ceramic.
Abstract: It is proposed to estimate wind velocity, Angle-Of-Attack (AOA) and Sideslip Angle (SSA) of a fixed-wing Unmanned Aerial Vehicle (UAV) using only kinematic relationships with a Kalman Filter ...
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