The Nexperia chip crisis is gradually calming down, but the disruption has already had significant impacts on the automotive ...

Oki Electric Industry and Nisshinbo Micro Devices in Tokyo are collaborating to develop a new type of thin-film 3D analogue IC. These chips are designed to ...

CYBERJAYA: Malaysia today achieved another milestone in the semiconductor industry with the inauguration of the Advanced Chip ...

WPG Holdings, Edom Technology, and Supreme Electronics reported their October 2025 results, highlighting robust AI-driven ...

Silicon X Sdn Bhd, a homegrown integrated circuit (IC) design company, has achieved a major milestone in Malaysia’s ...

China's trade ministry is probing US semiconductor firms, demanding sensitive sales data and customer details for an anti-dumping investigation into a ...

The Dutch government’s repossession of auto chip powerhouse Nexperia from its Chinese parent looks to be spreading pain ...

Delivers an authentic listening experience by expressing the three elements of spatial reverberation, quietness, and dynamic range while preserving the natural “texture” of musical instruments Santa ...

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

When used together, SF-BGA64F-B-01 SMT foot and SK-BGA64F-Z-M-01 socket assembly enable the socketing of Motorola Cobra or Atmel T89C51CC01 BGA 0.8-mm chips. The 6.5-GHz socket is slightly larger than ...