Abstract: A defective through-silicon via (TSV) may cause a small delay fault that is difficult to detect using conventional logic testing methods. Testing TSVs used for chip-to-chip interconnection ...
Abstract: The MEdium Resolution Spectral Imager-II (MERSI-II) on board the Fengyun-3D satellite is an advanced imaging instrument with 250/1000 m spatial resolution. This instrument is a valuable ...
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