Substrate, a start-up founded in 2022, has raised $100 million in a successful funding round to challenge ASML.

Ceva has announced a partnership with embedUR systems to launch the ModelNova platform for Ceva’s NeuPro NPU family.

Same Sky Interconnect Group continues expansion of its pogo pins product line with new models with ratings up to 25Amps.

Yokogawa's LS3300 Precision AC Power Calibrator now comes with the added option of Harmonic Output Capability.

NXP has announced the industry’s first Electrochemical Impedance Spectroscopy (EIS) battery management chipset.

Ambiq Micro, a provider of ultra-low-power semiconductor and AI solutions, has announced the Apollo510 Lite SoC.

The QSMP-23 module adds 1GB LPDDR4 RAM, 4GB eMMC and power management, integrated on a tiny footprint QFN package for EMC ...

Automation systems require compact, interference-resistant connection solutions and, in response, binder is expanding its existing M8 portfolio with moulded, 360° shielded signal connectors.

Microchip Technology has released the TimeProvider 4500 v3 grandmaster clock (TP4500) designed to deliver sub-nanosecond ...

Ceva-Waves Wi-Fi 7 1x1 client IP brings advanced Wi-Fi 7 capabilities to AI-enabled IoT devices and physical AI systems.

Nordic announces industry-first with support for Bluetooth Channel Sounding using its open-source Android app.

In valley skipping, ST’s valley lock stabilises the number of valleys skipped to prevent variations at audio frequencies and ...