Semiconductor Engineering

Thermal Simulation And Optimization in 3D-IC Design (Intel, UCSB, Cadence)

Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by ...

Murata Manufacturing collaborates with Cadence to streamline project efficiency

Murata Manufacturing Co Ltd announced a significant collaboration with Cadence Design Systems for making product libraries directly accessible with Cadence’s leading Electronic Design Automation (EDA) ...

Streamlining Project Efficiency with Murata’s Pre-Installed Electrical Models in the Latest Versions of Cadence OrCAD X Capture™, Allegro X System Capture™ and AW…

Murata announces a significant collaboration with Cadence, making product libraries directly accessible within Cadence’s ...
IEEE

A Novel Design Approach Using Zero-Pole-Based Multiport Model for Reconfigurable Intelligent Surfaces

Abstract: Reconfigurable intelligent surfaces (RISs) are of potential use in 5G/6G wireless communications due to their tunable electromagnetic (EM) parameters for flexible beam manipulations. Two ...
IEEE

ASIC Implementation of Pre-Trained CNN for Image Classification Using GPDK90nm Technology

Abstract: This work presents the development of a custom convolutional neural network (CNN) architecture for image classification, efficiently implemented on a hardware platform such as the Raspberry ...