No single material parameter can ensure reliability. Adhesion, stress resistance, and thermal stability all must be balanced ...

UCIe verification; automotive ECU QA; pre-silicon planning; compact model extraction; monitoring data center chips.

A new technical paper titled “Multimodal Chip Physical Design Engineer Assistant” was published by researchers at National ...

A new technical paper titled “Directed self-assembly of block copolymers for high-precision patterning in the era of extreme ...

Researchers from Ulsan National Institute of Science and Technology (UNIST) built an ultra-small hybrid low-dropout regulator ...

The engineer decides to make a virtual twin (process model) of the etch process to mimic the actual behavior of the wafer ...

AI and capacitive micromachined ultrasonic transducer chips are making diagnostics faster and more accessible.

DRAM is becoming more complicated to develop, and more difficult to manage inside AI data centers. In the past, latency, ...

A new approach enhances AI understanding through hierarchical clustering techniques with LLM-driven keyphrase extraction.

The state of photomask revenues, EUV pellicles, and curvilinear masks.

Heterogeneous integration is more than a technical milestone—it’s a strategic enabler of the next wave of digital ...

A new technical paper titled “Three-dimensional integrated hybrid complementary circuits for large-area electronics” was published by researchers at KAUST, Imperial College London and the University ...