Substrate, a start-up founded in 2022, has raised $100 million in a successful funding round to challenge ASML.

Ceva has announced a partnership with embedUR systems to launch the ModelNova platform for Ceva’s NeuPro NPU family.

Same Sky Interconnect Group continues expansion of its pogo pins product line with new models with ratings up to 25Amps.

Yokogawa's LS3300 Precision AC Power Calibrator now comes with the added option of Harmonic Output Capability.

Automation systems require compact, interference-resistant connection solutions and, in response, binder is expanding its existing M8 portfolio with moulded, 360° shielded signal connectors.

NXP has announced the industry’s first Electrochemical Impedance Spectroscopy (EIS) battery management chipset.

The QSMP-23 module adds 1GB LPDDR4 RAM, 4GB eMMC and power management, integrated on a tiny footprint QFN package for EMC ...

Ambiq Micro, a provider of ultra-low-power semiconductor and AI solutions, has announced the Apollo510 Lite SoC.

Toshiba Electronics Europe has expanded its standard digital isolator lineup with the addition of new devices.

POLYN announces successful manufacturing and testing of its silicon-proven implementation of its NASP technology.

Nordic announces industry-first with support for Bluetooth Channel Sounding using its open-source Android app.

Qualcomm has unveiled two new AI chips intended for data centres, with commercial availability scheduled from 2026.